Sonoscan Imaging Permits Bonded Wafer Rework.

• Author: Foster, Sharon
• Position: Introducing AW20000 - Product Announcement

Wafers, which make up part of the circuitry in computer chips, can now be bonded using a new automated bonding system developed by Sonoscan Inc., of Elk Grove Village, Illinois. Bonded wafers use lower power, have faster speeds and can even resist radiation, according to Sonoscan officials. Separating, cleaning and re-bonding defective wafer pairs can bring substantial savings, officials said.

Handling wafers up to 8 inches in diameter, the automated system--known as AW20000--images bonded wafers for particles and other defects between the wafers. The automated system sends sound waves to see inside the wafers to identify any problems. Field reports indicate that the system is especially useful in imaging wafers after initial bonding. This procedure is necessary to insure...