Vol. 31 Nbr. 5, May 2014

Index

• Apex a sign of trade show ... what, exactly?
• Advanced Circuits installed an Excellon Cobra Hybrid laser via drill at its facility in Tempe.
• Altium.
• Carano inducted into IPC Hall of Fame.
• ECD.
• Glenn Wells.
• IPC releases conflict minerals data exchange standard.
• Isola names Gastonguay President-Americas.
• Isola.
• LPKF.
• National Association of Professional Women.
• PCB West.
• Sunshine Global.
• Sunstone Circuits.
• University of Illinois.
• Uyemura.
• AIM BRL Marketing & Sales representative.
• BTU executed an agreement with SMarTsol Technologies to supplement the company's support infrastructure.
• Computrol purchased a Technical Devices' Flood Box.
• Creation Technologies.
• DfR Solutions.
• EU.
• Europlacer Americas.
• GHSP purchased a SEHO PowerWave N2 soldering line for its Grand Rapids.
• Jaltek Systems selected a MIRTEC.
• Joseph Juarez Jr., Ph.D., of Honeywell Air Transport Systems, along with colleagues Michael Robinson and Joel Heebink; and Polina Snugovsky, Ph.D., Eva Kosiba, Jeffrey Kennedy, Zohreh Bagheri, Suthakaran Subramaniam and Marianne Romansky of Celestica, won best paper at IPC Apex Expo.
• Libra Industries.
• MC Assembly installed.
• Neways hops on bus opportunity.
• OK International has closed on a minority investment and product development agreement.
• QuikTek Assembly.
• US Federal Appeals Court says Dodd-Frank violates 1st amendment.
• Viscom.
• Zestron.
• Feb. A/V increase.
• Gartner raises IT spending outlook.
• Key components.
• Metals index.
• Q4 PCB design software sales up 6%.
• TV picture looking dimmer.
• US manufacturing indices.
• War profitable for portable PC makers.
• When 'scaling up' leads to 'belly up': growth at all costs usually costs too much.
• Eastern-US: China's new competitor? Parity emerges among EMS Factories from Asia, Mexico and the US.
• Effectively managing PCB design constraints: constrain what is necessary, but don't go overboard.
• Conductor routing on flex boards: Part two of how to design a flex circuit.
• Power electronics packages with embedded components--recent trends and developments: results of a cross-industry team's development and testing of a PCB-based embedded chip technology for an under-the-hood automotive application.
• Automating stencil design: stencil design software has evolved from simple rule checkers to custom, sophisticated engineering tools.
• A public-private partnership that works: faced with a doubling of its workforce, a new production schedule emerges.
• Good values in Vegas: the electronics assembly industry (along with a few fabricators) agrees that better times are ahead in 2014.
• Advances in fluid dispensing technology: a look at piezoelectric-based pump technology for jetting materials in low volumes.
• Opens or not? It depends not just on where one looks, but when.
• Tin whisker revelations: a multi-part study found plenty of whiskers, but not where they were expected.
• Lean supply chain tradeoffs: multiple ways to refine inventory management.
• OSP replaces ENIG: a green fractured fairy tale: when development boards fail, is it the fixture or the finish?
• 'No netlist' JTAG.
• CAD placement/routing.
• EMC simulation.
• Power IC library.
• SI analyzer.
• SMD component library.
• Timing simulation tool.
• User-controlled routing.
• Web-based DFM report.
• 9MP inline AOI.
• Emboss tape feeder.
• Low VOC stencil cleaner.
• Product model verification.
• Reel storage tower.
• Remote defect monitoring.
• Stockroom kitting tool.
• Universal part holder.
• Water-soluble flux removal.
• In case you missed it.