Vol. 31 Nbr. 5, May 2014
Index
- Apex a sign of trade show ... what, exactly?
- Advanced Circuits installed an Excellon Cobra Hybrid laser via drill at its facility in Tempe.
- Altium.
- Carano inducted into IPC Hall of Fame.
- ECD.
- Glenn Wells.
- IPC releases conflict minerals data exchange standard.
- Isola names Gastonguay President-Americas.
- Isola.
- LPKF.
- National Association of Professional Women.
- PCB West.
- Sunshine Global.
- Sunstone Circuits.
- University of Illinois.
- Uyemura.
- AIM BRL Marketing & Sales representative.
- BTU executed an agreement with SMarTsol Technologies to supplement the company's support infrastructure.
- Computrol purchased a Technical Devices' Flood Box.
- Creation Technologies.
- DfR Solutions.
- EU.
- Europlacer Americas.
- GHSP purchased a SEHO PowerWave N2 soldering line for its Grand Rapids.
- Jaltek Systems selected a MIRTEC.
- Joseph Juarez Jr., Ph.D., of Honeywell Air Transport Systems, along with colleagues Michael Robinson and Joel Heebink; and Polina Snugovsky, Ph.D., Eva Kosiba, Jeffrey Kennedy, Zohreh Bagheri, Suthakaran Subramaniam and Marianne Romansky of Celestica, won best paper at IPC Apex Expo.
- Libra Industries.
- MC Assembly installed.
- Neways hops on bus opportunity.
- OK International has closed on a minority investment and product development agreement.
- QuikTek Assembly.
- US Federal Appeals Court says Dodd-Frank violates 1st amendment.
- Viscom.
- Zestron.
- Feb. A/V increase.
- Gartner raises IT spending outlook.
- Key components.
- Metals index.
- Q4 PCB design software sales up 6%.
- TV picture looking dimmer.
- US manufacturing indices.
- War profitable for portable PC makers.
- When 'scaling up' leads to 'belly up': growth at all costs usually costs too much.
- Eastern-US: China's new competitor? Parity emerges among EMS Factories from Asia, Mexico and the US.
- Effectively managing PCB design constraints: constrain what is necessary, but don't go overboard.
- Conductor routing on flex boards: Part two of how to design a flex circuit.
- Power electronics packages with embedded components--recent trends and developments: results of a cross-industry team's development and testing of a PCB-based embedded chip technology for an under-the-hood automotive application.
- Automating stencil design: stencil design software has evolved from simple rule checkers to custom, sophisticated engineering tools.
- A public-private partnership that works: faced with a doubling of its workforce, a new production schedule emerges.
- Good values in Vegas: the electronics assembly industry (along with a few fabricators) agrees that better times are ahead in 2014.
- Advances in fluid dispensing technology: a look at piezoelectric-based pump technology for jetting materials in low volumes.
- Opens or not? It depends not just on where one looks, but when.
- Tin whisker revelations: a multi-part study found plenty of whiskers, but not where they were expected.
- Lean supply chain tradeoffs: multiple ways to refine inventory management.
- OSP replaces ENIG: a green fractured fairy tale: when development boards fail, is it the fixture or the finish?
- 'No netlist' JTAG.
- CAD placement/routing.
- EMC simulation.
- Power IC library.
- SI analyzer.
- SMD component library.
- Timing simulation tool.
- User-controlled routing.
- Web-based DFM report.
- 9MP inline AOI.
- Emboss tape feeder.
- Low VOC stencil cleaner.
- Product model verification.
- Reel storage tower.
- Remote defect monitoring.
- Stockroom kitting tool.
- Universal part holder.
- Water-soluble flux removal.
- In case you missed it.