Vol. 30 Nbr. 10, October 2013

Index

• Ruling classes.
• 2014 PCD&F NPI fabrication awards open.
• Agilent Technologies.
• Agilent to spin off measurements group.
• Arnold Sema.
• Bill Hargin.
• Clay Christoffersen, Bryan Fish and Dennis Whitacre.
• Ian Kenyon.
• Kai Wamock.
• Koch Industries will buy Molex.
• Mentor Graphics.
• Michael Gleason.
• NCAB Group.
• New EPA webtool simplifies chemicals management.
• OnCore opens design center outside Chicago.
• PCB Libraries.
• Peter Diamandis.
• Tobias Martin.
• 2014 CIRCUITS ASSEMBLY NPI Awards open.
• Carrie Goodell.
• Dick Johnson.
• EMS Firm ACD appointed Charmoneik Gray (top left) and Shavon Brown (bottom left) project coordinators.
• Essemtec named Hitech Electronica.
• Jabil.
• Jerry Schock.
• M-Flex.
• Microtek Laboratories.
• Miqro Innovation Collaborative Centre (C2MI).
• Nori Onda.
• Paul Lancaster.
• Rafi Albarian.
• TTM to shutter Suzhou PCB site.
• Wally Johnson.
• Apple looking into latest worker abuse claims.
• Cogiscan.
• Europlasma.
• Firstronic.
• Foxconn.
• Goepel.
• Harting.
• High-rel radio OEM XetaWave plans to invest $7 million in a new 24,000 sq. ft. plant and pull manufacturing in-house.
• IC package pitch headed widely to 0.4mm.
• Jabil Circuit.
• Jabil.
• Manu-Tec.
• Mirtec Europe.
• Neways Electronics.
• Panasonic Factory Solutions.
• Plexus expanding to Guadalajara.
• Solderstar.
• Speedprint.
• Totech Super Dry.
• Virtex.
• Auto infotainment driving electronics makers' sales.
• German PCB orders up big YoY in June.
• Global disk storage revenues down 5% in Q2.
• Key components.
• Less in storage.
• Metals index.
• US manufacturing indices.
• Worldwide Q2 server shipments up 4%.
• Were you lucky, or good? An honest post-mortem is the prequel to planning.
• Dynamically in sync: despite a difference in market size, Singapore's manufacturing sector has strong parallels to the US's.
• Dual row QFNs: friend or foe? How to prevent the space-saving parts from causing headaches at assembly.
• The hot zone: for thermal management, how does FPC compare to rigid material?
• More industry standards? QFNs have advantages over BGAs, but preconditioning specs and test methods are in order.
• Making simulation a 'SNAP': a new online CAD library pairs specifications and social conversations in a dashboard-view of electronic components.
• Real-time etching using ozone: eliminating hydrogen peroxide enhances safety. But what will the traces look like?
• A custom BGA for particle physics experiments: how a novel high-yield package cut costs by 32% vs. COB.
• Metals from Africa: who's afraid of Dodd-Frank? How a coalition of companies and NGOs are opening up the Congolese tin trade.
• Improving placement modularity through shared resources: novel functionality accommodates changing production requirements without reconfiguring the line.
• Multiple fiducial capture: why board stretch makes printing tight panels like nailing jelly to a wall.
• Finding fault: testing mission-critical functions in automotive electronics.
• Antenna design.
• Antenna grade laminate.
• Cutout software.
• Enterprise PCB CAD.
• Lean Six-Sigma software.
• Library creation app.
• Low-loss laminate.
• PCB plotter.
• Smart viewer software.
• Benchtop temp controller.
• Boundary scan tester.
• High force ACF bonder.
• Inline selective soldering.
• Multipurpose microscope.
• Placement Nozzles.
• Portable ICT.
• Predictive analytics tool.
• Underfill jetting software.
• In case you missed it.