Vol. 30 Nbr. 10, October 2013
Index
- Ruling classes.
- 2014 PCD&F NPI fabrication awards open.
- Agilent Technologies.
- Agilent to spin off measurements group.
- Arnold Sema.
- Bill Hargin.
- Clay Christoffersen, Bryan Fish and Dennis Whitacre.
- Ian Kenyon.
- Kai Wamock.
- Koch Industries will buy Molex.
- Mentor Graphics.
- Michael Gleason.
- NCAB Group.
- New EPA webtool simplifies chemicals management.
- OnCore opens design center outside Chicago.
- PCB Libraries.
- Peter Diamandis.
- Tobias Martin.
- 2014 CIRCUITS ASSEMBLY NPI Awards open.
- Carrie Goodell.
- Dick Johnson.
- EMS Firm ACD appointed Charmoneik Gray (top left) and Shavon Brown (bottom left) project coordinators.
- Essemtec named Hitech Electronica.
- Jabil.
- Jerry Schock.
- M-Flex.
- Microtek Laboratories.
- Miqro Innovation Collaborative Centre (C2MI).
- Nori Onda.
- Paul Lancaster.
- Rafi Albarian.
- TTM to shutter Suzhou PCB site.
- Wally Johnson.
- Apple looking into latest worker abuse claims.
- Cogiscan.
- Europlasma.
- Firstronic.
- Foxconn.
- Goepel.
- Harting.
- High-rel radio OEM XetaWave plans to invest $7 million in a new 24,000 sq. ft. plant and pull manufacturing in-house.
- IC package pitch headed widely to 0.4mm.
- Jabil Circuit.
- Jabil.
- Manu-Tec.
- Mirtec Europe.
- Neways Electronics.
- Panasonic Factory Solutions.
- Plexus expanding to Guadalajara.
- Solderstar.
- Speedprint.
- Totech Super Dry.
- Virtex.
- Auto infotainment driving electronics makers' sales.
- German PCB orders up big YoY in June.
- Global disk storage revenues down 5% in Q2.
- Key components.
- Less in storage.
- Metals index.
- US manufacturing indices.
- Worldwide Q2 server shipments up 4%.
- Were you lucky, or good? An honest post-mortem is the prequel to planning.
- Dynamically in sync: despite a difference in market size, Singapore's manufacturing sector has strong parallels to the US's.
- Dual row QFNs: friend or foe? How to prevent the space-saving parts from causing headaches at assembly.
- The hot zone: for thermal management, how does FPC compare to rigid material?
- More industry standards? QFNs have advantages over BGAs, but preconditioning specs and test methods are in order.
- Making simulation a 'SNAP': a new online CAD library pairs specifications and social conversations in a dashboard-view of electronic components.
- Real-time etching using ozone: eliminating hydrogen peroxide enhances safety. But what will the traces look like?
- A custom BGA for particle physics experiments: how a novel high-yield package cut costs by 32% vs. COB.
- Metals from Africa: who's afraid of Dodd-Frank? How a coalition of companies and NGOs are opening up the Congolese tin trade.
- Improving placement modularity through shared resources: novel functionality accommodates changing production requirements without reconfiguring the line.
- Multiple fiducial capture: why board stretch makes printing tight panels like nailing jelly to a wall.
- Finding fault: testing mission-critical functions in automotive electronics.
- Antenna design.
- Antenna grade laminate.
- Cutout software.
- Enterprise PCB CAD.
- Lean Six-Sigma software.
- Library creation app.
- Low-loss laminate.
- PCB plotter.
- Smart viewer software.
- Benchtop temp controller.
- Boundary scan tester.
- High force ACF bonder.
- Inline selective soldering.
- Multipurpose microscope.
- Placement Nozzles.
- Portable ICT.
- Predictive analytics tool.
- Underfill jetting software.
- In case you missed it.