Vol. 28 Nbr. 10, October 2011

Index

• No blue sky.
• ACD.
• Altium.
• Bare Board Group.
• Bay Area Circuits.
• Dynachem-ALT.
• James Mahoney.
• Jedec.
• Keith Margolin.
• National Instruments.
• Panasonic ED to build PCB plant in Vietnam.
• PCD&F, Circuits Assembly open 2012 NPI Award.
• Sakai Denshi Kogyo.
• Severe flooding damages NY area plants.
• Sierra Circuits.
• Teknoflex.
• Wrekin Circuits.
• Alex Kuo.
• Analyst: electronics outsourcing trending toward Mexico.
• Chris Cleland West.
• Elcoteq.
• ESDA, Jedec publish revision to ESD testing spec.
• Huawei Technologies.
• Hunter snares spinnaker microwave.
• Kimball.
• Norm Faucher.
• Ole Thers.
• Presto Engineering.
• R&D Technical Services.
• Rick Cummings.
• Rob Snyder.
• SMTC.
• Terry Walton.
• Ting-Feng "Tony" Ge.
• 3M.
• Auditor questions SMT Holdings' future.
• Christopher Associates.
• Computrol.
• CyberOptics.
• Mirae.
• OnCore acquires Victron.
• Production Solutions.
• Speedprint.
• Universal Instruments.
• 3D LCD TV panels up big.
• Caution, concern over production.
• Further DRAM price drops in store.
• PCB production up 19% in 2010.
• Getting in tune: challenges never change, but our approaches to tackling them must evolve.
• Is the sales funnel really dead? Not in the least. The trick is knowing its application.
• Thin is in! IMAPS' latest workshop showed just how far wafer-level packages have come.
• Echoes of bits past: reflection noise is the most common source of jitter in high-speed digital signals.
• No substitute: if that specific part is in short supply, how do you find a suitable replacement?
• Flex in 3D: or how to interconnect in multiples planes without needing separate connections.
• Understanding PCBs for high-frequency applications: electrical performance at microwave frequencies can be aided by the surface finish and laminate choice.
• Out of the fire, ACD heats up: a design service bureau rebounds from a disaster to become a full-fledged EMS.
• Why does SPI have such huge tolerances? Spend some time on the SMT line, and you'll know why.
• The all-good 'type half': tighter paste particle distribution can benefit print performance.
• Tin Whisker qualification and reliability testing: no panacea exists, but certain coatings are getting closer.
• Expanding coverage with boundary scan: boundary scan is the present and the future. Are you ready?
• Cosiderations for precision cleaning: knowing the substrate and contamination types helps inform the cleaning agent.
• Aligning systems between operational business models: how to overcome miscommunication and redundancy in EMS partnerships.
• 0.25MM pitch FPC connector.
• Electromagnetic design software.
• Engineering automation software.
• Multi-blade depanelizers.
• PCB plasma system.
• SI, PI analysis.
• Stackup planner.
• Transient bidirectional co-simulation.
• Wiring harness E-CAD.
• 'No-solvent' conformal coating.
• 3-Axis transport systems.
• 3D inspection device.
• Cabinet test oven.
• Handheld parts counter.
• Hipot tester.
• Inline selective soldering.
• Multi-use silicone resins.
• Tape-and-reel loading.
• 3D prototype circuit writer.
• Batch stencil cleaner.
• Benchtop rework platform.
• Halogen-free solder paste.
• Large-format x-ray.
• No-clean flux.
• Quick-change placement.
• Six-Sigma speed printer.
• Syringe barrel tip caps.
• In case you missed it.