Vol. 27 Nbr. 9, September 2010

Index

• The REACH pandemic.
• Alex Cox.
• Camstar Systems.
• David Crimp.
• Epec Engineered Technologies.
• Ibiden.
• IPC updates surface mount land pattern standard.
• ITT.
• Karl Doebbert.
• Kevin Perhamus.
• Magneti Marelli.
• Meiko to expand in China, Vietnam.
• Mentor Graphics.
• Mentor, NI provide test feedback for designers.
• Milplex Circuit.
• MIT.
• Seica.
• Steven R. Calvert.
• Uyemura.
• Aegis.
• All Flex.
• ASM to buy Siemens' placement business.
• AsteelFlash to build 3d Tunisia plant.
• EE Technologies Inc.
• Elcoteq.
• Enics.
• iNEMI.
• IPC.
• Juki Automation Systems.
• Koh Young.
• MiTAC International.
• Note Ab.
• Schweizer seeks embedded component patent.
• Twitter.
• Acculogic's.
• Christopher Associates.
• Computrol.
• Datest.
• Electrolube.
• Foxconn.
• Foxconn: 50% EMS share in 2011?
• Jennifer Howell.
• Jerry Ji.
• Liang Zong.
• Manufacturing Resource Corp.
• Natalie Bulkley.
• Neil Mac-Raild.
• Peter Laveson.
• Sabina Romagnolo.
• Smart Group to release updated Pb-free defect guide.
• US enacts 'conflict metal' law.
• Computing comeback.
• Industry market snapshot.
• Manufacturing up for 12th straight month.
• Metals Index.
• Q2 semi sales up 7%.
• Solar expansion to continue.
• Study: selective soldering market to hit $44M by 2015.
• The dysfunction of EMS and tragedy of Foxconn: the company's handling of a suicide cluster overshadows the context.
• The economic innovation dilemma: why buying from the lowest-cost provider is a downward spiral for OEMs.
• Copy cats: don't let dumb errors morph into de facto standards.
• Will LEDs light up the world? Assembly packaging could mean a bright future.
• Seeing the light: LEDs are no longer just for the "on" switch.
• Repeatable FPGA-on-board optimization: simply recreating the PCB information adds steps, but little else.
• Automating the documentation process: dedicated tools help reduce the once-manual job by 20% of the typical design cycle time.
• Best practices for double-sided mixed-technology boards: be aware that heavy parts are prone to falling off during soldering.
• A critique of IPC-A-610E: a master trainer assesses the revised industry guidelines for PCB acceptability.
• Present and future solder technologies: how new powders, activator chemistries and epoxy fluxes are evolving for production use.
• Post-reflow residue results following pH-neutral cleaner application: a study of 40 leaded and Pb-free solders compares alkaline to newer cleaning technologies.
• Problems and promises of BTCs: from QFNs to DFNs to MLPs, these packages are cheap, but tricky.
• Know your nozzles! The wider the diameter, the faster solder joints will form.
• The reballing process: using preforms, balls can be removed and reattached in an hour.
• Successful ICT boundary scan implementation: eight steps to getting the best possible test coverage.
• Bridging causes, part 3: identify and solve placement and reflow-related solder defects.
• Rolling with solder balls: finer powders may be more prone to solder balling.
• A 'disconnection approach' to cleaning process selection: breaking down cleaning processes into basic building blocks reveals the optimal choice.
• Evolution in the solar show circuit: as with SMT, expect consolidation, especially in China.
• Bidirectional PCB/RF design.
• Edge-card socket.
• EMI shielding gaskets.
• EP CAM software.
• Inkjet-printable conductive INK.
• Parasitic extraction tool.
• Phototooling GUI.
• Small-scale PCB design tool.
• Thermosetting resin analysis.
• Conformal coat inspection.
• Desktop wirebond AOI.
• Dual-placement Line.
• Noncorrosive metals adhesive.
• Pick-and-place test handler.
• Placement nozzles.
• SI reactive hot melt.
• Turnkey test station.
• Upgraded barcode imager.
• Halogen-free polyimide label.
• High-speed code reader.
• Inline jet Fluxer.
• Large load lift.
• LED placement.