Vol. 27 Nbr. 9, September 2010
Index
- The REACH pandemic.
- Alex Cox.
- Camstar Systems.
- David Crimp.
- Epec Engineered Technologies.
- Ibiden.
- IPC updates surface mount land pattern standard.
- ITT.
- Karl Doebbert.
- Kevin Perhamus.
- Magneti Marelli.
- Meiko to expand in China, Vietnam.
- Mentor Graphics.
- Mentor, NI provide test feedback for designers.
- Milplex Circuit.
- MIT.
- Seica.
- Steven R. Calvert.
- Uyemura.
- Aegis.
- All Flex.
- ASM to buy Siemens' placement business.
- AsteelFlash to build 3d Tunisia plant.
- EE Technologies Inc.
- Elcoteq.
- Enics.
- iNEMI.
- IPC.
- Juki Automation Systems.
- Koh Young.
- MiTAC International.
- Note Ab.
- Schweizer seeks embedded component patent.
- Twitter.
- Acculogic's.
- Christopher Associates.
- Computrol.
- Datest.
- Electrolube.
- Foxconn.
- Foxconn: 50% EMS share in 2011?
- Jennifer Howell.
- Jerry Ji.
- Liang Zong.
- Manufacturing Resource Corp.
- Natalie Bulkley.
- Neil Mac-Raild.
- Peter Laveson.
- Sabina Romagnolo.
- Smart Group to release updated Pb-free defect guide.
- US enacts 'conflict metal' law.
- Computing comeback.
- Industry market snapshot.
- Manufacturing up for 12th straight month.
- Metals Index.
- Q2 semi sales up 7%.
- Solar expansion to continue.
- Study: selective soldering market to hit $44M by 2015.
- The dysfunction of EMS and tragedy of Foxconn: the company's handling of a suicide cluster overshadows the context.
- The economic innovation dilemma: why buying from the lowest-cost provider is a downward spiral for OEMs.
- Copy cats: don't let dumb errors morph into de facto standards.
- Will LEDs light up the world? Assembly packaging could mean a bright future.
- Seeing the light: LEDs are no longer just for the "on" switch.
- Repeatable FPGA-on-board optimization: simply recreating the PCB information adds steps, but little else.
- Automating the documentation process: dedicated tools help reduce the once-manual job by 20% of the typical design cycle time.
- Best practices for double-sided mixed-technology boards: be aware that heavy parts are prone to falling off during soldering.
- A critique of IPC-A-610E: a master trainer assesses the revised industry guidelines for PCB acceptability.
- Present and future solder technologies: how new powders, activator chemistries and epoxy fluxes are evolving for production use.
- Post-reflow residue results following pH-neutral cleaner application: a study of 40 leaded and Pb-free solders compares alkaline to newer cleaning technologies.
- Problems and promises of BTCs: from QFNs to DFNs to MLPs, these packages are cheap, but tricky.
- Know your nozzles! The wider the diameter, the faster solder joints will form.
- The reballing process: using preforms, balls can be removed and reattached in an hour.
- Successful ICT boundary scan implementation: eight steps to getting the best possible test coverage.
- Bridging causes, part 3: identify and solve placement and reflow-related solder defects.
- Rolling with solder balls: finer powders may be more prone to solder balling.
- A 'disconnection approach' to cleaning process selection: breaking down cleaning processes into basic building blocks reveals the optimal choice.
- Evolution in the solar show circuit: as with SMT, expect consolidation, especially in China.
- Bidirectional PCB/RF design.
- Edge-card socket.
- EMI shielding gaskets.
- EP CAM software.
- Inkjet-printable conductive INK.
- Parasitic extraction tool.
- Phototooling GUI.
- Small-scale PCB design tool.
- Thermosetting resin analysis.
- Conformal coat inspection.
- Desktop wirebond AOI.
- Dual-placement Line.
- Noncorrosive metals adhesive.
- Pick-and-place test handler.
- Placement nozzles.
- SI reactive hot melt.
- Turnkey test station.
- Upgraded barcode imager.
- Halogen-free polyimide label.
- High-speed code reader.
- Inline jet Fluxer.
- Large load lift.
- LED placement.